Thermal-Mechanical Characterization/Selection of a Two-Part Epoxy Cure

Profile for Structural Bonding

Zach Hollcraft, Cham Hang Yeung, Talia Vyeson, Adriano Liao, Seniors, Anthony Bou, Mechanical Engineering

Dr. John Bridge, Assoc Prof, Mechanical Engineering, Sponsored by Collins Aerospace

Description – Design Constraints:

An off-the-shelf two-part thermoset epoxy, used for

structural bonding of commercial jet aircraft interiors,

was tested and analyzed to find improved cure profiles

over manufacturer-supplied cure specifications. Testing

Mechanical lap-shear

tensile testing on all cure

profiles provided average

and peak shear strengths

for the epoxy:

Scanning Electron Microscope (SEM):

Future Experiments/Discussion:

Additional cure profiles should be considered at a wider

range of temperatures and cure times. Also, additional

DSC testing on proposed cures would provide useful

align and clamp the tensile test

sample plates while curing to

ensure a complete bond.

Contact:

keith.anderson2@collins.com, hollczac@uw.edu, bouda@uw.edu,

The 5 days (room-temperature) epoxy sample

SEM pictures of the 5-day room temperature

cure. Sample fracture surface was observed

to analyze fracture geometry and look for

possible contaminants or air bubbles.

@ 250°F cure as having the highest average peak break

strength. Additional testing of planned cure profiles, and

DSC testing, would have supplied important statistics to

determine optimal cure profiles for different situations.

Cure

Profile